XCVM1502-2MSEVFVC1760 System On Chip (SoC)_BOSICHUANG_ Relay_ Integrated Circuit IC_Connector_ Transformer_ Transisto_ Xilinx

XCVM1502-2MSEVFVC1760

Product_Category

System On Chip (SoC)

Manufacturer

Xilinx (AMD)

Type

IC VERSALPRIME ACAP FPGA 1760BGA

Encapsulation

Packages

Tray

RoHS

YES

Price

$8,292.5000

Specifications

PDF(1)

TYPE	DESCRIPTION
Mfr	Xilinx (AMD)
Series	Versal™ Prime
Package	Tray
Product Status	ACTIVE
Package / Case	1760-BFBGA, FCBGA
Speed	600MHz, 1.4GHz
RAM Size	256KB
Number of I/O	500
Operating Temperature	0°C ~ 110°C (TJ)
Core Processor	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes	Versal™ Prime FPGA, 1M Logic Cells
Connectivity	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals	DDR, DMA, PCIe
Supplier Device Package	1760-FCBGA (40x40)
Architecture	MPU, FPGA

$74.0900

$101.9000

$124.4000

$86.9000

$12.9500